APPLICATION OF CHIP SEAL DESIGN : A Case study

dc.authorid0009-0008-3591-5338
dc.authorid0000-0001-7539-8285
dc.contributor.authorErdoğan, Halis
dc.contributor.authorBozkurt, Hasan
dc.date.accessioned2023-07-14T08:39:20Z
dc.date.available2023-07-14T08:39:20Z
dc.date.issued2022en_US
dc.departmentEnstitüler, Lisansüstü Eğitim Enstitüsü, İnşaat Mühendisliği Ana Bilim Dalı
dc.departmentFakülteler, Mühendislik Fakültesi, İnşaat Mühendisliği Bölümü
dc.description.abstractDue to the increasing prices of road construction materials every day, road construction costs are gradually increasing in Turkey. For this reason, the low cost and easy application of chip seals make their use very attractive. As well as being a low-cost superstructure layer, it should also have high performance. A good coating design is the basis for obtaining a high-performance coating layer. For many years, chip seal design in Turkey has been realized by adapting the methods developed by other countries to the country's conditions. However, since the design values and application values did not coincide, the design methods was revised for our country. The developed "KGM Chip Seal Design Method" was created by taking into account the climate and terrain conditions in our country. Thus, the surface coating performance has improved positively.The design process of the chip seal was carried out under different climatic, terrain and material conditions using the specified design method. With the designs performed, the most appropriate material quantities to be used in the chip seal design were determined. Based on the material quantities determined, the parameters affecting the chip seal performance were evaluated and discussed.en_US
dc.identifier.citationErdoğan, Halis & Bozkurt, Hasan (2022). APPLICATION OF CHIP SEAL DESIGN : A Case study, BSEU Journal Of Engineering Research and Technology. 3(2), 21-28.en_US
dc.identifier.endpage28en_US
dc.identifier.issue2en_US
dc.identifier.startpage21en_US
dc.identifier.urihttps://hdl.handle.net/11552/3033
dc.identifier.volume3en_US
dc.institutionauthorErdoğan, Halis
dc.institutionauthorBozkurt, Hasan
dc.language.isoen
dc.publisherBilecik Şeyh Edebali Üniversitesien_US
dc.relation.ispartofBSEU Engineering Research and Technology ( BSEUJERT )
dc.relation.publicationcategoryMakale - Uluslararası - Editör Denetimli Dergien_US
dc.rightsinfo:eu-repo/semantics/openAccess
dc.rights.urihttp://creativecommons.org/licenses/by-nd/3.0/us/*
dc.subjectChip Sealen_US
dc.subjectChip Seal Desingen_US
dc.subjectHighway Materialsen_US
dc.titleAPPLICATION OF CHIP SEAL DESIGN : A Case study
dc.typeArticle

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